July 29, 2021

Automotive Mogul

Automatic Road Vehicle

Tong Hsing to expand packaging capacity for automotive CIS

Tong Hsing to expand packaging capacity for automotive CIS

Backend dwelling Tong Hsing Electronic Industries ideas to grow manufacturing capability in 3 phases for automotive CMOS graphic sensors (CIS), even though Chinese friends are also imposing capability expansions for lower-end CIS solutions, in accordance to field resources.

Apart from handset programs, CIS gadgets are progressively demanded for vehicle works by using, specially ADAS (highly developed driver aid methods), along with the at any time-growing penetration of automotive electronics, prompting Tong Hsing to step up potential enlargement for automotive CIS, the resources stated.

Tong Hsing has accomplished its initial-phase capability expansion, and is pending clients’ validations for the 2nd-stage expansion ahead of entering the final stage by the end of 2021 or early 2022, with a 10% ability enhance established for just about every phase, the sources famous.

The enterprise has landed major orders from 1st-tier global automotive CIS vendors which includes On-Semi and Sony, and its BGA packaging lines are running at full potential to fulfill the orders, the resources claimed.

Tong Hsing now also processes car or truck strain sensors and features ceramic substrates for automotive LED chips for Foxconn centered on a strategic alliance among its parent firm Yageo and the top EMS, the resources indicated, including it will see its revenue contribution ratio for automotive applications surge to 40% this 12 months.

The corporation continues to offer you wafer reconstruction services for large-conclude handset CIS products from OmniVision Technologies (OVT), while the China-based mostly vendor’s plant in Songjiang, Shanghai has commenced to take care of similar solutions on its personal for decrease-conclude handset CIS products.

China’s OSATs Tianshui Huatian and China Wafer Stage CSP are also deepening deployments in lower-stop CIS for handsets. The former has acquired TSV (by silicon by using) packaging technological know-how from an Israel lover and is implementing potential expansion for CIS packaging, with its revenues estimated to double right after the new capacity is completely ready for volume production by the close of third-quarter 2021, the resources said.